![]() Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. No-clean solder paste is by far the most prevalent solder paste in modern electronic manufacturing, but there is still a purpose and a fit for water-soluble and RMA solder paste as well. Solder Paste Features & Benefits Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. AuLTRA™ 3.2 and AuLTRA™ 5.1 solder pastes are available in these alloy compositions: 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, and 77Au/23Sn, and powder sizes 2 to 7SGS. ![]() These AuSn solder pastes offer consistent printing and reflow, in addition to exceptional wetting and low-voiding. Why? And why might we want to use tests that are even more challenging than the current J-STD-004B? Read More When Life Gives You Lumens, Make LED Paste!ĪuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and assembly needs required in high-power LED module array applications. Read More Enhanced SIR testing for Reliability Read More The Pin-in-Paste Process with Donut-Shaped Preformsįolks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of solder paste for the p. What is usually called solder paste “flux” is a combination of activat. Read More The Importance of an Oxygen Barrier In Solder Paste Fluxįolks, Solder paste is arguably one of the most highly engineered materials. One of the obvious reasons is that a circle of diameter D. Circular Apertures and the Five Ball Rule Revisitedįolks, I recently posted that circular apertures deliver much less solder past than square apertures. SiP & Heterogeneous Integration & Assembly (HIA)Ĭlose Related Solder Paste Blog Articles Square vs.The Indium Corporation & Macartney Family Foundation.
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